LIVE WEBINAR
From Noise to Signal: Avoiding Million-Dollar Excursions with Basic Data Visualization
Date: Tuesday, Sept. 1
Time: 2 p.m. ET | 11 a.m. PT
Duration: 1 hour
Registration: FREE
Modern semiconductor fabs generate vast amounts of inspection and metrology data, yet quickly identifying the root cause of yield excursions remains a challenge. When defects cluster geographically on a wafer – such as edge rings, scratches, or localized hot spots – the source is often tied to a specific tool, chamber, or handling event.
During this webinar, explore how the Semiconductor Toolkit from the JMP Marketplace helps engineers rapidly root-cause yield issues. Through a realistic excursion scenario, learn how to transform raw lot data into interactive wafer maps, identify meaningful spatial signatures, and connect those signatures to specific equipment and process steps.
Learn how to:
- Import and organize fab data using the Semiconductor Toolkit.
- Create and interpret interactive wafer maps to identify spatial defect patterns.
- Correlate defect signatures with tool and chamber history using JMP visualization tools.
- Build automated workflows and dashboards to detect excursions earlier.
Can’t join us live? No problem! Register anyway and you’ll receive the recording after the event.
About the Presenter
Mike Anderson,
Principal Systems Engineer
As a Principal Systems Engineer, Mike Anderson works with JMP's customers to help them develop sustainable cultures of analytic excellence.
Before joining JMP, he worked in a variety of roles in high-tech manufacturing, encompassing measurement statistics, Lean Six Sigma, and cost and defect reduction. Anderson holds advanced degrees in materials chemistry and semiconductor engineering from the University of Oregon, as well as Data Scientist and LSS Black Belt Certifications.