Live Webinar

Problem Solving Methodology for WLCSP Sidewall Crack due to Customer Complaint

- Establish structural problem-solving methodology, and utilize substantial /relevant process data for empirical and statistical types of analysis. -

Date: 31 May 2022
Time: 2:00PM - 3:00PM (Singapore) | 11:30AM - 12:30PM (India)| 4:00PM - 5:00PM (Australia)
Presenter: LM Shong,Senior Principle Engineer at NXP Malaysia
 Zoom Live Webinar
Registration: Free

Chronic customer returned incident for WLCSP packaged product are filed as a result of die crack and chipping issue. Limited sample of rejects are returned by customer for failure analysis and root cause investigation. In early stage of problem solving, because of failure to narrow down potential failure causes, no conjecture of statistical terms could be derived for an effective validation. If such stagnation is not changed, it will likely lead to customer frustration and the issue could be elevated.

A task force team is formed and drills down to two WLCSP Back-End (BE) Assembly processes for deep dive investigation. They establish structural problem-solving methodology which utilizes substantial /relevant process data for empirical and statistical types of analysis.

New problem hypotheses are derived. Opportunities of improvement are identified and implemented at WLCSP BE Assembly process. Baselining examination shows zero risk of die crack /chipping. No similar customer complaint has even been filed again.

With more than 20 years industrial experiences, LM Shong will share In this 1-hour webinar how he establishes problem solving methodology for WLCSP sidewall crack.

Topics Include:

  • Problem solving methodology 
  • Distribution analysis
  • Outlier analysis
  • Scatterplot and correlation
  • Practical case studies

Who is this webinar for? 

Engineers working in the Manufacturing Sector, Semiconductor, High-Tech, R&D department who wants to improve efficiency and effectiveness of analysis, especially relevant to:   

  • Process Engineer / Process Integration Engineer (PI)
  • New Process Integration Engineer (NPI) 
  • Product Engineer (PE) / Yield Enhanced Engineer (YE)
  • Product and Testing Engineer (PTE)
  • Quality Engineers (QE)

Remark: No recording will be shared for this webinar. 

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